What faults may occur in the use of integrated chip inductors? How can these failures be prevented?
Publish Time: 2024-08-23
Integrated chip inductors may encounter a variety of faults during use, which are usually related to factors such as manufacturing process, use environment, circuit design and material aging. Here are some common failure types and prevention methods:
Open or short circuit fault:
Fault performance: The inductor completely loses the inductance effect, and is shown as an open circuit, or an extremely low inductance value or even a short circuit.
Preventive measures: Select a reliable inductor supplier and conduct a strict incoming inspection; The proper overcurrent protection and short-circuit protection mechanism should be considered in circuit design. Avoid use in harsh environments such as high temperature and high humidity, or take appropriate protective measures.
Inductance value offset:
Fault performance: There is a large deviation between the actual inductance value and the nominal value of the inductor, which affects the circuit performance.
Preventive measures: Choose inductors with higher accuracy; The tolerance range of inductance change is considered in circuit design. Periodically detect the inductance value of the inductor, timely find and replace the inductor with a large deviation.
Magnetic saturation:
Fault performance: When the current in the inductor is too large, it may lead to saturation of the magnetic core, making the inductance value drop sharply, affecting the stability of the circuit.
Preventive measures: set current limit reasonably during circuit design to avoid magnetic saturation due to excessive current; Choose an inductor with a higher saturation current.
Thermal failure:
Failure performance: Working for a long time in a high temperature environment, the inductor may fail due to thermal stress, manifested as a change in inductance value or open circuit.
Preventive measures: Choose inductors that are resistant to high temperature; Consider heat dissipation measures in circuit design, such as increasing heat sink, optimizing layout, etc. Monitor the operating temperature of the inductor to avoid long periods of high temperature operation.
Mechanical damage:
Failure: During assembly or use, the inductor may be subjected to mechanical shock or vibration, resulting in damage to the internal structure.
Preventive measures: Handle gently during assembly to avoid excessive impact; Consider vibration isolation measures in circuit design; Choose an inductor with higher vibration resistance.
Chemical corrosion:
Failure: In humid or corrosive environments, the inductor may be chemically corroded, resulting in damage to the insulation or oxidation of metal components.
Preventive measures: Choose inductors with anti-corrosion coating; When used in a humid or corrosive environment, take moisture-proof and anti-corrosion measures; Check the appearance and insulation performance of the inductor regularly.
To sum up, in order to prevent the failure of the integrated chip inductor during use, it is necessary to carry out comprehensive consideration and implement measures from many aspects such as design, material selection, manufacturing process, use environment and regular maintenance.
